Study on critical rake angle in nanometric cutting

被引:68
作者
Lai, M. [1 ]
Zhang, X. D. [1 ]
Fang, F. Z. [1 ]
机构
[1] Tianjin Univ, State Key Lab Precis Measuring Technol & Instrume, Ctr MicroNano Mfg Technol, Tianjin 300072, Peoples R China
来源
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING | 2012年 / 108卷 / 04期
基金
中国国家自然科学基金;
关键词
MOLECULAR-DYNAMICS; CHIP THICKNESS; EDGE RADIUS;
D O I
10.1007/s00339-012-6973-8
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Molecular dynamics (MD) simulations of nanometric-cutting copper are conducted to study the critical rake angle during the cutting process. A new approach based on the maximum displacement of atoms in cutting direction is proposed to estimate the chip formation in MD simulation. It is found that the minimum rake angle for chip formation is -65 degrees-(-70 degrees) and the subsurface deformations of copper are mostly the dislocation and stacking faults. Three-dimensional simulation results show that the effective rake angle of stagnation region is constant with the same depth of cut. According to the limited depth of cut of copper can be achieved, the available minimum tool edge radius is suggested to be not less than 10 nm.
引用
收藏
页码:809 / 818
页数:10
相关论文
共 16 条
[1]   A study on mechanism of nano-cutting single crystal silicon [J].
Fang, F. Z. ;
Wu, H. ;
Zhou, W. ;
Hu, X. T. .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2007, 184 (1-3) :407-410
[2]   Modelling and experimental investigation on nanometric cutting of monocrystalline silicon [J].
Fang, FZ ;
Wu, H ;
Liu, YC .
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2005, 45 (15) :1681-1686
[3]   An experimental study of edge radius effect on cutting single crystal silicon [J].
Fang, FZ ;
Zhang, GX .
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2003, 22 (9-10) :703-707
[4]   Diamond cutting of silicon with nanometric finish [J].
Fang, FZ ;
Venkatesh, VC .
CIRP ANNALS 1998 - MANUFACTURING TECHNOLOGY, VOL 47, NO 1, 1998, 47 :45-49
[5]   Dislocation nucleation and defect structure during surface indentation [J].
Kelchner, CL ;
Plimpton, SJ ;
Hamilton, JC .
PHYSICAL REVIEW B, 1998, 58 (17) :11085-11088
[6]   Effect of tool geometry in nanometric cutting: a molecular dynamics simulation approach [J].
Komanduri, R ;
Chandrasekaran, N ;
Raff, LM .
WEAR, 1998, 219 (01) :84-97
[7]   SOME ASPECTS OF MACHINING WITH NEGATIVE RAKE TOOLS SIMULATING GRINDING [J].
KOMANDURI, R .
INTERNATIONAL JOURNAL OF MACHINE TOOL DESIGN AND RESEARCH, 1971, 11 (03) :223-+
[8]   Some aspects of machining with negative-rake tools simulating grinding: a molecular dynamics simulation approach [J].
Komanduri, R ;
Chandrasekaran, N ;
Raff, LM .
PHILOSOPHICAL MAGAZINE B-PHYSICS OF CONDENSED MATTER STATISTICAL MECHANICS ELECTRONIC OPTICAL AND MAGNETIC PROPERTIES, 1999, 79 (07) :955-968
[9]   Modelling and analysis of micro scale milling considering size effect, micro cutter edge radius and minimum chip thickness [J].
Lai, Xinmin ;
Li, Hongtao ;
Li, Chengfeng ;
Lin, Zhongqin ;
Ni, Jun .
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2008, 48 (01) :1-14
[10]   An analytical model for the prediction of minimum chip thickness in micromachining [J].
Liu, X. ;
DeVor, R. E. ;
Kapoor, S. G. .
JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME, 2006, 128 (02) :474-481