Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers-Part 2: Parametric Study of EMMCs for High Heat Flux (∼1kW/cm2) Power Electronics Cooling

被引：10

作者：

Jung, Ki Wook ^{[1
]}

Hazra, Sougata ^{[1
]}

Kwon, Heungdong ^{[1
]}

Piazza, Alisha ^{[1
]}

Jih, Edward ^{[2
]}

Asheghi, Mehdi ^{[1
]}

Gupta, Man Prakash ^{[2
]}

Degner, Michael ^{[2
]}

Goodson, Kenneth E. ^{[1
]}

机构：

[1] Stanford Univ, Dept Mech Engn, Stanford, CA 94305 USA

[2] Ford Motor Co, Dearborn, MI 48124 USA

来源：

JOURNAL OF ELECTRONIC PACKAGING | 2020年 / 142卷 / 03期

基金：

美国国家科学基金会;

关键词：

embedded microchannels; 3D-manifold; computational fluid dynamics (CFD); single-phase water; OPTIMIZATION; SINK; PERFORMANCE; WATER;

D O I：

10.1115/1.4047883

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Thermal management of power electronics modules is one of the limiting factors in the peak power capability of the traction inverter system and overall efficiency of the e-drive. Liquid cooling using embedded microchannels with a three-dimensional (3D)-manifold cooler (EMMC) is a promising technology capable of removingheat fluxes of >1kW/cm(2) at tens of kPa pressure drop. In this work, we utilize computational fluid dynamics (CFD) simulations to conduct a parametric study of selected EMMC designs to improve the thermofluidic performance for a 5mmx5mm heated area with the applied heat flux of 800W/cm(2) using single-phase water as working fluid at inlet temperature of 25 degrees C. We implemented strategies such as: (i) symmetric distribution of manifold inlet/outlet conduits, (ii) reducing the thickness of cold-plate (CP) substrate, and (iii) increasing fluid-solid interfacial area in CP microchannels, which resulted in a reduction in thermal resistance from 0.1 for baseline design to 0.04cm(2) K/W, while the pressure drop increased from 8 to 37kPa.

引用

页数：11

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