Recycling Glass Fiber/Epoxy Resin of Waste Printed Circuit Boards: Morphology and Mechanical properties

被引：17
作者：
Dangtungee, R. [1 ,2 ]
Somchua, S. [1 ]
Siengchin, S. [3 ]
机构：
[1] King Mongkuts Univ Technol N Bangkok, Dept Ind Chem, Fac Sci Appl, Bangkok 10800, Thailand
[2] King Mongkuts Univ Technol N Bangkok, Sci & Technol Res Inst, Res Ctr Nano Ind & Biopolymer, Bangkok 10800, Thailand
[3] King Mongkuts Univ Technol N Bangkok, Sirindhorn Int Thai German Grad Sch Engn TGGS, Dept Prod Engn, Bangkok 10800, Thailand
来源：
MECHANICS OF COMPOSITE MATERIALS | 2012年 / 48卷 / 03期
关键词：
glass fiber; composite; recycling; epoxy resin; printed circuit board; NITRIC-ACID; TECHNOLOGY; NONMETALS;
D O I：
10.1007/s11029-012-9279-1
中图分类号：
O3 [力学];
学科分类号：
08 ; 0801 ;
摘要：
Various composites were prepared from recycled waste printed circuit boards and an epoxy resin, and some of their mechanical properties (hardness, elongation at break, tensile and flexural strengths and moduli, and impact energy) were determined experimentally. The results obtained are presented in the form of diagrams.
引用
收藏
页码：325 / 330
页数：6
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