Pressureless Silver Sintering Die-Attach for SiC Power Devices

被引：13

作者：

Hascoet, Stanislas ^{[1
]}

Buttay, Cyril ^{[1
]}

Planson, Dominique ^{[1
]}

Chiriac, Rodica ^{[2
]}

Masson, Amandine ^{[1
]}

机构：

[1] Univ Lyon, INSA Lyon, Lab Ampere, CNRS,UMR 5005, F-69621 Villeurbanne, France

[2] Univ Lyon, CNRS UMR 5615, LMI, F-69622 Lyon, France

来源：

SILICON CARBIDE AND RELATED MATERIALS 2012 | 2013年 / 740-742卷

关键词：

silver sintering; die-attach;

D O I：

10.4028/www.scientific.net/MSF.740-742.851

中图分类号：

O7 [晶体学];

学科分类号：

0702 ; 070205 ; 0703 ; 080501 ;

摘要：

Pressureless silver sintering is an interesting die-attach technique that could overcome the reliability limitations of the power electronic devices caused by their packaging. In this paper, we study the manufacturing parameters that affect the die attach: atmosphere, drying time, heating ramp rate, sintering temperature and duration. It is found that sintering under air gives better results, but causes the substrates to oxidize. Sintering under nitrogen keeps the surfaces oxide-free, at the cost of a weaker attach.

引用

页码：851 / +

页数：2

共 50 条

[31] Impact of die-attach materials on MEMS Gyro performance
Filipe, A.
Vincent, M.
Volant, V.
Kergueris, C.
2014 1ST IEEE INTERNATIONAL SYMPOSIUM ON INERTIAL SENSORS AND SYSTEMS (ISISS 2014), 2014, : 125 - 126
[32] AN OVERVIEW OF DIE-ATTACH MATERIAL FOR HIGH TEMPERATURE APPLICATIONS
Tan, Kim Seah
Noordin, Norasiah Mohammad
Cheong, Kuan Yew
PROCEEDING OF THE 3RD INTERNATIONAL CONFERENCE OF GLOBAL NETWORK FOR INNOVATIVE TECHNOLOGY 2016 (3RD IGNITE-2016): ADVANCED MATERIALS FOR INNOVATIVE TECHNOLOGIES, 2017, 1865
[33] Evaluation of Stiffness-Reduced Joints by Transient Liquid-Phase Sintering of Copper-Solder-Resin Composite for SiC Die-Attach Applications
Tatsumi, Hiroaki
Lis, Adrian
Yamaguchi, Hiroshi
Kashiba, Yoshihiro
Hirose, Akio
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (10): : 2111 - 2121
[34] Applications of Low Temperature Sintering Technology as Die Attach for High Temperature Power Modules
Wu, Yibo
Zhao, Yimin
Wang, Yangang
Jones, Steve
Dai, Xiaoping
Liu, Guoyou
2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 452 - 457
[35] Silver Sintering for Silicon Carbide Die Attach: Process Optimization and Structural Modeling
Calabretta, Michele
Sitta, Alessandro
Oliveri, Salvatore Massimo
Sequenzia, Gaetano
APPLIED SCIENCES-BASEL, 2021, 11 (15):
[36] Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test
Liu, Shenyi
Vuorinen, Vesa
Liu, Xing
Fredrikson, Olli
Brand, Sebastian
Tiwary, Nikhilendu
Lutz, Josef
Paulasto-Krockel, Mervi
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2024, 39 (12) : 16695 - 16707
[37] Effect of die-attach adhesives on the stress evolution in MEMS packaging
Walwadkar, SS
Farrell, PW
Felton, LE
Cho, J
2003 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2003, 5288 : 847 - 852
[38] Fine Die-Attach Delamination Analysis by Scanning Acoustic Microscope
Santospirito, G.
Terzoli, A.
2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, : 187 - 190
[39] Characterization and Mechanism of Sintered-silver Die-attach on Electroless Nickel Surface Finish with Different Phosphorus Content
Wang, Meiyu
Zhang, Haobo
Tian, Siyi
Gao, Peng
Du, Xiaona
Yan, Haidong
2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2024,
[40] Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress
An, Jun Eon
Park, Usung
Jung, Dong Geon
Park, Chihyun
Kong, Seong Ho
SENSORS, 2019, 19 (18)

← 1 2 3 4 5 →