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- [32] Study of the Radio Frequency (RF) performance of a Wafer-Level Package (WLP) with Through Silicon Vias (TSVs) for the integration of RF-MEMS and micromachined waveguides in the context of 5G and Internet of Things (IoT) applications. Part 2: parameterised 3D model and optimisation MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2021, 27 (01): : 223 - 234
- [33] Study of the Radio Frequency (RF) performance of a Wafer-Level Package (WLP) with Through Silicon Vias (TSVs) for the integration of RF-MEMS and micromachined waveguides in the context of 5G and Internet of Things (IoT) applications. Part 2: parameterised 3D model and optimisation Microsystem Technologies, 2021, 27 : 223 - 234
- [34] To examine the role of climate risk exposure in corporate capital structure decisions, we use a large sample of firms across 35 countries from 2001 to 2021 and show a significantly positive association between firms' climate risk exposure and speed of leverage adjustment based on a two-step partial leverage adjustment model. A one- standard-deviation increase in climate risk exposure increases firms' SOA by 5.59%. A plausible explanation is that climate risk exposure mitigates agency conflicts and improves information efficiency. The positive rela- tionship is stronger in firms from countries with better climate governance, lower bank financing support, and higher policy quality. Overall, our study demonstrates the critical role of climate risk in capital structure de- cisions in the global context. JOURNAL OF CLEANER PRODUCTION, 2023, 389