Design of CNFET based power- and variability-aware nonvolatile RRAM cell

被引:7
作者
Pal, Soumitra [1 ]
Gupta, Vivek [2 ]
Islam, Aminul [2 ]
机构
[1] Hong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Clear Water Bay, Hong Kong, Peoples R China
[2] Birla Inst Technol, Dept Elect & Commun Engn, Ranchi 835215, Jharkhand, India
来源
MICROELECTRONICS JOURNAL | 2019年 / 86卷
关键词
RRAM; Nonvolatile memory; CNFET; Memristor; Hold power; Read delay; Write delay; TRANSISTORS INCLUDING NONIDEALITIES; COMPACT SPICE MODEL; SRAM CELL; CIRCUIT-DESIGN; CARBON; MOBILITY;
D O I
10.1016/j.mejo.2019.02.009
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper a Power- and Variability-Aware Nonvolatile RRAM Cell (4CNFET2M) is presented. Memristor is used as a nonvolatile memory element. We have compared our proposed cell with standard 6T SRAM (S6T) cell and 2T2M RRAM cell (state of the art design based on memristor). The proposed cell shows 1.26 x /3.61 x shorter read delay/write delay variability compared to 2T2M. 4CNFET2M also shows 1.39 x narrower read delay variability compared to S6T. Furthermore, the proposed cell shows 6.4 x shorter write delay in comparison to 2T2M RRAM cell. 4CNFET2M consumes 10(6) x /2.02 x lower power during hold mode compared to conventional S6T SRAM/2T2M RRAM cell. Furthermore, the proposed cell also shows improvement in hold power variability compared to both the cells. All the simulated data, presented here, are for 1 V supply voltage. These improvements are achieved because of using the memristor and CNFET technology. These benefits are obtained at a cost of slightly longer read delay compared to 2T2M/S6T and 33.6 x longer write delay compared to S6T.
引用
收藏
页码:7 / 14
页数:8
相关论文
共 44 条
[1]   Leakage power analysis and reduction for nanoscale circuits [J].
Agarwal, A ;
Mukhopadhyay, S ;
Raychowdhury, A ;
Roy, K ;
Kim, CH .
IEEE MICRO, 2006, 26 (02) :68-80
[2]  
Ali M, 2015, IEEE INT C NAN, P1218
[3]   High precision tuning of state for memristive devices by adaptable variation-tolerant algorithm [J].
Alibart, Fabien ;
Gao, Ligang ;
Hoskins, Brian D. ;
Strukov, Dmitri B. .
NANOTECHNOLOGY, 2012, 23 (07)
[4]  
[Anonymous], MODEL EARTH SYST ENV
[5]  
[Anonymous], 2014 IEEE INT EL DEV
[6]  
[Anonymous], 2015, 2015 INT JOINT C NEU, DOI DOI 10.1109/IJCNN.2015.7280518
[7]  
[Anonymous], 2015, P IEEE INT EL DEV M, DOI [10.1109/IEDM.2015.7409815, DOI 10.1109/IEDM.2015.7409815]
[8]   Carbon nanotubes for high-performance electronics - Progress and prospect [J].
Appenzeller, J. .
PROCEEDINGS OF THE IEEE, 2008, 96 (02) :201-211
[9]  
Batude P., 2011, 2011 International Electron Devices Meeting, p7.3.1, DOI DOI 10.1109/IEDM.2011.6131506
[10]   A MOSFET electron mobility model of wide temperature range (77-400 K) for IC simulation [J].
Chain, K ;
Huang, JH ;
Duster, J ;
Ko, PK ;
Hu, CM .
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 1997, 12 (04) :355-358