Polymer optical interconnects -: A scalable large-area panel processing approach

被引:25
|
作者
Uhlig, S [1 ]
Fröhlich, L
Chen, MX
Arndt-Staufenbiel, N
Lang, G
Schröder, H
Houbertz, R
Popall, M
Robertsson, M
机构
[1] Linkoping Univ, SE-60174 Norrkoping, Sweden
[2] Fraunhofer Inst Silicatforsch, D-97082 Wurzburg, Germany
[3] Fraunhofer Inst Zuverlassigkeit & Mikrointegrat, D-13355 Berlin, Germany
[4] ACREO AB, SE-60221 Norrkoping, Sweden
来源
关键词
flexible manufacturing approach; hybrid polymers; large-area processing; optical backplane; optical interconnect review; ORMOCER; polymer optical waveguide; projection UV lithogaphy;
D O I
10.1109/TADVP.2005.849555
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A flexible approach to producing optical interconnects on 609.6 * 609.6 mm large-area panels is demonstrated. Stepwise projection patterning from 101.6 * 101.6 mm masks has generated optical waveguide patterns over the whole panel using large-area projection lithography equipment. The waveguide routing design allows optical waveguides on different 1.01.6 * 101.6 mm tiles to be interconnected. Four different waveguide connecting geometries in the border region between tiles have been fabricated and tested. Multimode waveguides from inorganic-organic hybrid polymers (ORMOCER) (cross section: <= 50 mu m * 10 mu m) with refractive index step between core and cladding Delta n = 0.01 were produced. The index step was adjusted by mixing two diffrent ORMOCER systems. The materials show good adhesion to numerous substrates, such as glass and silicon. Application concepts such as flexible manufacturing of optoelectrical hybrid backplanes with two-dimensional interconnect, a three-dimensional optical interconnect with optical vias, and a hybrid backplane with the optical interconnect in a strip-format on a separate plane right above the electrical plane are proposed. Promising new technologies are presented along with preliminary demonstrativ viability.
引用
收藏
页码:158 / 170
页数:13
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