共 33 条
[3]
Cai W., 2013, U. S. Patent, Patent No. [8,444,039, 8444039]
[8]
Mechanical analysis of ultrasonic bonding for rapid prototyping
[J].
JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME,
2002, 124 (02)
:426-434
[9]
GRAFF KF, 1974, P IEEE ULTR S, P628
[10]
Kang B., 2013, J MANUF PRO IN PRESS