ELECTRO-MECHANICAL ANALYSIS OF PIEZOELECTRIC PATCH BONDING TO BEAMS

被引:0
作者
Yang, Jing [1 ]
Wang, Yun [2 ]
Xu, Rong-qiao [1 ]
机构
[1] Zhejiang Univ, Dept Civil Engn, Hangzhou 310058, Zhejiang, Peoples R China
[2] Hangzhou Dianzi Univ, Sch Mech Engn, Hangzhou 310018, Peoples R China
来源
2011 SYMPOSIUM ON PIEZOELECTRICITY, ACOUSTIC WAVES AND DEVICE APPLICATIONS (SPAWDA) | 2011年
基金
中国国家自然科学基金;
关键词
Piezoelectric Patch; Energy Harvesting; Structural Health Monitoring; Piezoelectric Strain Gauge;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Due to the outstanding electromechanical coupling property, piezoelectric materials played an important role in smart structures, structural health monitoring, strain measurement, and energy harvesting. In these applications, the piezoelectric materials were usually fabricated in form of patches and bonded on the surfaces of host structures. As a result, the interaction between the surface-bonded piezoelectric patch with the host structures should be well understood to design or manufacture. However, very limited research was available in the literatures. This works derived the coupled governing equation of the strains of the piezoelectric patch and surface of the host structures including the electromechanical coupling effect of piezoelectric materials. The dynamic one was also presented and the effect of the circuit resistance was also considered. Some numerical examples were given to demonstrate the present method and the results were compared with those by finite element method.
引用
收藏
页码:465 / 468
页数:4
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