Diffusion bonding of Ti/Ni under the influence of an electric current: mechanism and bond structure

被引：19

作者：

Gao, Xiufeng ^{[1
]}

Chen, Shaoping ^{[1
]}

Dong, Feng ^{[1
]}

Hu, Lifang ^{[1
]}

Yang, Renyao ^{[1
]}

Wang, Wenxian ^{[1
]}

Munir, Zuhair A. ^{[2
]}

机构：

[1] Taiyuan Univ Technol, Coll Mat Sci & Engn, Taiyuan 030024, Peoples R China

[2] Univ Calif Davis, Dept Mat Sci & Engn, Davis, CA 95616 USA

来源：

JOURNAL OF MATERIALS SCIENCE | 2017年 / 52卷 / 06期

基金：

美国国家科学基金会;

关键词：

PRESSURE-ASSISTED SYNTHESIS; FIELD; MICROSTRUCTURE; INTERMETALLICS; SEQUENCE; STRENGTH; SYSTEMS; GROWTH; JOINTS; ALLOY;

D O I：

10.1007/s10853-016-0648-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The diffusion bonding between Ti and Ni was investigated in the presence and absence of an imposed electric current. Bonding was carried out over the temperature range of 873-1123 K and the current density range of 255-350 A/cm(2). The formation and sequence of evolution of the three intermetallic phases, TiNi3, TiNi, and Ti2Ni, were investigated and discussed in light of calculations of Gibbs free energies of formation and interfacial energies associated with their nucleation. Within the experimental times and in the presence of a current, the growth of the three phases was parabolic. The evolution of the TiNi phase required an incubation period, while the relatively high growth rate of TiNi3 suggests the possibility of another mechanism. The growth of all phases was enhanced by the application of a direct current, with no apparent dependence on its direction.

引用

页码：3535 / 3544

页数：10

共 24 条

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