Effects of Annealing Twins on the Grain Growth and Mechanical Properties of Ag-8Au-3Pd Bonding Wires

被引：38

作者：

Chuang, Tung-Han ^{[1
]}

Tsai, Chih-Hsin ^{[1
,2
]}

Wang, Hsi-Ching ^{[1
]}

Chang, Che-Cheng ^{[1
]}

Chuang, Chien-Hsun ^{[1
]}

Lee, Jun-Der ^{[2
]}

Tsai, Hsing-Hua ^{[2
]}

机构：

[1] Natl Taiwan Univ, Inst Mat Sci & Engn, Taipei 106, Taiwan

[2] Wire Technol Co Ltd, Taichung 432, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2012年 / 41卷 / 11期

关键词：

Wire bonding; Ag-8Au-3Pd alloy wire; annealing twins; thermal stability; AU-AL; COPPER; STRENGTH;

D O I：

10.1007/s11664-012-2225-0

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An innovative Ag-8Au-3Pd bonding wire containing a large amount of annealing twins has been produced. In contrast to the apparent grain growth in a conventional Ag-8Au-3Pd wire during aging at 600A degrees C, the grain size of this annealing-twinned Ag alloy wire remains almost unchanged. The high thermal stability of the grain structure leads to a smaller heat-affected zone near the free air ball of this twinned wire. The annealing twins in this material also result in the dual merits of increased tensile strength and elongation with aging time, which is beneficial for the reliability of wire-bonded packages.

引用

页码：3215 / 3222

页数：8

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