Influence of impact angle on the interaction between Co55 nanocluster and Cu (001) substrate: Ionized cluster beam deposition

被引：4

作者：

Araghi, Houshang ^{[1
]}

Zabihi, Zabiholah ^{[1
]}

机构：

[1] Amirkabir Univ Technol, Dept Phys, Tehran, Iran

来源：

COMPUTATIONAL MATERIALS SCIENCE | 2013年 / 67卷

关键词：

Molecular dynamics; Nanocluster; Adhesion; Radial distribution function; Impact angle; MOLECULAR-DYNAMICS SIMULATION; SURFACE;

D O I：

10.1016/j.commatsci.2012.09.003

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Using a classical molecular dynamics method, the influence of impact angle was studied on the ionized cluster beam (ICB) deposition. A many-body tight binding potential was employed to simulate the interactions among the atoms, in which the Co-55 (55 atoms/cluster) nanocluster with the total energy of 110 eV was deposited on a Cu (0 0 1) substrate, whose temperature was set at 300 k. The quantitative of kinetic energy of the cluster, maximum temperature substrate, cluster center of mass and diffusion area of the cluster were proposed to evaluate the interacting mechanism nanocluster and substrate. Also, the influence of impact angle was investigated on the Co-Co and Cu-Co radial distribution function and the adhesion between cluster and substrate. The simulation data demonstrated the decrease of the maximum temperature substrate with the increase of impact angle. The results indicated the decrease in the maximum depth penetration with the increase in the impact angle. The thin film formed by Co-55 nanocluster with the impact angle of 30 degrees had the minimum adhesion with the substrate. (C) 2012 Elsevier B.V. All rights reserved.

引用

页码：109 / 112

页数：4

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