Interfacial reactions of Sn-58Bi and Sn-0.7Cu lead-free solders with Alloy 42 substrate

Eutectic Sn-58 wt%Bi (SB) and Sn-0.7 wt%Cu (SC) lead-free solders reacting with Alloy 42 substrates were investigated at 240, 270, 300, and 330 degrees C for various reaction times. The FeSn2 phase was the only phase formed at the solder/Alloy 42 interface for all couples. However, this FeSn2 phase had two different microstructures. The intermetallic compound (IMC) morphology near the solder/Alloy 42 interface was dense with a tiny microstructure after reflowing at 240 degrees C. Massive spalling FeSn2 phases with large and platy grain were observed in the solder matrix. When the reflow temperature was increased the IMC morphology assumed bulk or cylindrical shape with no spalling IMCs observed at the solder/Alloy 42 interface. The IMC thickness increased with increasing reaction temperature and time. Both SB/Alloy 42 and SC/Alloy 42 couples presented a diffusion controlled growth mechanism in. The activation energies for SB/Alloy 42 and SC/Alloy 42 couples were 86.2 and 103.4 kJ/mol, respectively. (C) 2013 Elsevier Ltd. All rights reserved.