Silicon Microneedles for Transdermal Applications by Electrochemical Micromachining Technology

被引:0
作者
Longo, Angela [1 ]
Strambini, Lucanos Marsilio [1 ]
Ventrelli, Letizia [1 ]
Barillaro, Giuseppe [1 ]
机构
[1] Univ Pisa, Dipartimento Ingn Informaz, Pisa, Italy
来源
2014 IEEE SENSORS | 2014年
关键词
DRUG; DELIVERY; ARRAY;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report a novel, versatile, and low-cost approach for fabrication of out-of-plane silicon microneedles for transdermal applications. Unlike state-of-the-art microneedles reported so far, the microneedles of this work feature a built-in reservoir in each single needle-core to be used in future applications for drug storing and delivery after insertion in the skin. The microneedles, with size up to ten times thinner than a human hair, height of about 100 mu m, and density of 10000 needles/cm(2) (spatial period 100 mu m) are effectively fabricated by silicon electrochemical micromachining (ECM) technology. In-vitro insertion tests, which are carried out on synthetic skins made out of alginate hydrogels with different concentrations, clearly demonstrate penetration reliability of such tiny needles.
引用
收藏
页数:3
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