Transient Simulation of Lossy Interconnects using the Latency Insertion Method (LIM)

被引：0
|
作者：
Klokotov, Dmitri [1 ]
Schutt-Aine, Jose [1 ]
机构：
[1] Univ Illinois, Dept Elect & Comp Engn, Urbana, IL 61801 USA
来源：
2008 IEEE-EPEP ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2008年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this work an extension of the Latency Insertion Method (LIM) formulation to the treatment of networks with frequency-dependent parameters is discussed. It is shown that the algorithm can be transformed to allow, efficient simulation of both skin effect of conductors as well as frequency dependent substrate loss in high speed circuit interconnects.
引用
收藏
页码：233 / 236
页数：4
相关论文
共 50 条
  • [1] IBIS Simulation Using the Latency Insertion Method (LIM)
    Schutt-Aine, Jose E.
    Liu, Ping
    Tan, Jilin
    Varma, Ambrish
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2013, 3 (07): : 1228 - 1236
  • [2] Latency insertion method (LIM) for the fast transient simulation of large networks
    Schutt-Ainé, JE
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-FUNDAMENTAL THEORY AND APPLICATIONS, 2001, 48 (01): : 81 - 89
  • [3] Latency Insertion Method for the Analysis of Steady State On-Chip Power Distribution Networks and Transient Simulation of Lossy Interconnects
    Klokotov, Dmitri
    Schutt-Aine, Jose
    APMC: 2008 ASIA PACIFIC MICROWAVE CONFERENCE (APMC 2008), VOLS 1-5, 2008, : 2406 - 2409
  • [4] Transient simulation of lossy multiconductor interconnects
    Canavero, F
    Maio, I
    1997 INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, PROCEEDINGS, 1997, : 243 - 246
  • [5] Using the Latency Insertion Method (LIM) to Generate X Parameters
    Comberiate, Thomas M.
    Schutt-Aine, Jose E.
    2012 IEEE 21ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, 2012, : 280 - 283
  • [6] Block Latency Insertion Method (Block-LIM) for Fast Transient Simulation of Tightly Coupled Transmission Lines
    Sekine, Tadatoshi
    Asai, Hideki
    EMC 2009: IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, TECHNICAL PAPER, 2009, : 253 - 257
  • [7] Stability analysis of latency insertion method (LIM)
    Deng, ZC
    Schutt-Aine, JE
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2004, : 167 - 170
  • [8] Alternating Direction Explicit-Latency Insertion Method (ADE-LIM) for the Fast Transient Simulation of Transmission Lines
    Kurobe, Hiroki
    Sekine, Tadatoshi
    Asai, Hideki
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 2 (05): : 783 - 792
  • [9] Block-Latency Insertion Method (Block-LIM) for Fast Transient Simulation of Tightly Coupled Transmission Lines
    Sekine, Tadatoshi
    Asai, Hideki
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2011, 53 (01) : 193 - 201
  • [10] Transient simulation of lossy interconnects based on the recursive convolution
    Fang, Yiyuan
    Lin, Zhenghui
    Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, 1997, 31 (01): : 45 - 50
12345