Power Electronics Cooling of 100 W/cm2 Using AC Electroosmotic Pump

被引:12
作者
Berrouche, Youcef [1 ]
Avenas, Yvan [2 ]
机构
[1] Mondevert Ca, Montreal, PQ J4V2M5, Canada
[2] Grenoble Univ, G2ELab, F-38402 St Martin Dheres, France
关键词
Electronics cooling; pressure control; temperature control; thermal analysis; SYSTEMS;
D O I
10.1109/TPEL.2013.2253129
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The power electronics cooling system should be able to dissipate very high heat flux densities (watts per surface area). For that, many solutions can be used: liquid forced convection, heat pipes, capillary loops, and so on. In the forced convection cooling system case, one of the hotspots is the mechanical pump. We propose in this paper to study the possibility of replacing the conventional mechanical pumps by electroosmotic (EO) pump. The pump based on porous ceramic seems well suited for this application. In this paper, after a few reminders on electroosmosis pumping theory, the new modification of our second prototype will be presented. Then, the test bench and the experiment results of the second prototype with a power electronics device will be presented and discussed. It will be shown that the pump generates 20 ml/min and it is used to evacuate 100 W/cm(2) of heat flux generated by the power electronics device.
引用
收藏
页码:449 / 454
页数:6
相关论文
共 16 条
[1]   Optimization of high flow rate nanoporous electroosmotic pump [J].
Berrouche, Y. ;
Avenas, Y. ;
Schaeffer, C. ;
Wang, P. ;
Chang, H. -C. .
JOURNAL OF FLUIDS ENGINEERING-TRANSACTIONS OF THE ASME, 2008, 130 (08)
[2]   Design of a Porous Electroosmotic Pump Used in Power Electronic Cooling [J].
Berrouche, Youcef ;
Avenas, Yvan ;
Schaeffer, Christian ;
Chang, Hsueh-Chia ;
Wang, Ping .
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2009, 45 (06) :2073-2079
[3]  
BRASK A, 2005, THESIS TU DENMARK CO
[4]   A review of heat pipe systems for heat recovery and renewable energy applications [J].
Chaudhry, Hassam Nasarullah ;
Hughes, Ben Richard ;
Ghani, Saud Abdul .
RENEWABLE & SUSTAINABLE ENERGY REVIEWS, 2012, 16 (04) :2249-2259
[5]  
Chen ZL, 2001, ELECTROPHORESIS, V22, P3339, DOI 10.1002/1522-2683(200109)22:15<3339::AID-ELPS3339>3.0.CO
[6]  
2-5
[7]   A comparative study of cooling of high power density electronics using sprays and microjets [J].
Fabbri, M ;
Jiang, SJ ;
Dhir, VK .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2005, 127 (01) :38-48
[8]   High power multichip modules employing the planar embedding technique and microchannel water heat sinks [J].
Hahn, R ;
Kamp, A ;
Ginolas, A ;
Schmidt, M ;
Wolf, J ;
Glaw, V ;
Topper, M ;
Ehrmann, O ;
Reichl, H .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1997, 20 (04) :432-441
[9]  
Hunter R. J., 1981, ZETA POTENTIAL COLLO, P17
[10]  
Meysenc L., 1998, THESIS I NATL POLYTE