A 273-301-GHz Amplifier With 21-dB Peak Gain in 65-nm Standard Bulk CMOS

被引:30
|
作者
Tokgoz, Korkut Kaan [1 ,2 ]
Abdo, Ibrahim [1 ]
Fujimura, Takuya [1 ]
Pang, Jian [1 ]
Kawano, Yoichi [3 ]
Iwai, Taisuke [3 ]
Kasamatsu, Akifumi [4 ]
Watanabe, Issei [4 ]
Okada, Kenichi [1 ]
机构
[1] Tokyo Inst Technol, Dept Elect & Elect Engn, Tokyo 1528552, Japan
[2] NEC Corp Ltd, Kawasaki, Kanagawa 2118666, Japan
[3] Fujitsu Labs Ltd, Atsugi, Kanagawa 2430197, Japan
[4] NICT, Koganei, Tokyo 1848795, Japan
关键词
300; GHz; amplifier; bulk CMOS; layout optimization; low-loss passives; positive feedback (PF); subterahertz;
D O I
10.1109/LMWC.2019.2908335
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This letter presents a world-first 300-GHz amplifier in 65-nm standard bulk CMOS (1P9M GP). The amplifier has gain from 273 to 301 GHz, and the peak gain is 21 dB at 298 GHz. The amplifier has 16-stage positive-feedback common-source topology. The power consumption is 35.4 mW from a 1.2-V supply. Transistor (1 mu m x 8 mu m) layout is optimized for minimizing gate and channel resistance to increase gain corner frequency from 250 GHz (conventional design kit-based transistor measurement result) to 270 GHz, and f(max) from around 300 GHz (design kit based) up to 317 GHz. Four transistor widths of 8, 10, 20, and 30 mu m with the optimized layout are compared with the terms of f(max) proving that the 8-mu m width transistor has the highest f(max) and hence used in the 300-GHz amplifier design. The dc-blocking capacitors are 10-fF finger-based design, which has lower loss than conventional MOM capacitors, since the fingers are formed on the top metal that is the thickest metal layer in the process.
引用
收藏
页码:342 / 344
页数:3
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