Full Color Top Emission AMOLED Displays on Flexible Metal Foil

被引:0
作者
Hack, Michael [1 ]
Hewitt, Richard [1 ]
Urbanik, Ken [1 ]
Chwang, Anna [1 ]
Brown, Julie J. [1 ]
Lu, JengPing
Shih, Chinwen
Ho, Jackson
Street, Bob
Ramos, Teresa
Rutherford, Nicole
Tognoni, Keith
Anderson, Bob
Huffman, Dave
机构
[1] Univ Display Corp, Ewing, NJ 08618 USA
来源
IMID/IDMC 2006: THE 6TH INTERNATIONAL MEETING ON INFORMATION DISPLAY/THE 5TH INTERNATIONAL DISPLAY MANUFACTURING CONFERENCE, DIGEST OF TECHNICAL PAPERS | 2006年
关键词
OLED; phosphorescence; top emission; PHOLED; metal foil substrate;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Advanced mobile communication devices require a bright, high information content display in a small, light-weight. low power consumption package. For portable applications flexible (or conformable) and rugged displays will be the future. In this paper we outline our progress towards developing such a low power consumption active-matrix flexible OLED (FOLED (TM)) display. We demonstrate full color 100 ppi QVGA active matrix OLED displays on flexible stainless steel substrates. Our work in this area is focused on integrating three critical enabling technologies. The first technology component is based on UDC's high efficiency long-lived phosphorescent OLED (PHOLED (TM)) device technology, which has now been commercially demonstrated as meeting the low power consumption performance requirements for mobile display applications. Secondly, is the development of flexible active-matrix backplanes, and for this our team are employing PARC's Excimer Laser Annealed (ELA) poly-Si TFTs formed on metal foil substrates as this approach represents an attractive alternative to fabricating poly-Si TFTs on plastic for the realization of first generation flexible active matrix OLED displays. Unlike most plastics, metal foil substrates can withstand a large thermal load and do not require a moisture and oxygen permeation barrier. Thirdly, the key to reliable operation is to ensure that the organic materials are fully encapsulated in a package designed for repetitive flexing, and in this device we employ a multilayer thin film Barix encapsulation technology in collaboration with Vitex systems. Drive electronics and mechanical packaging are provided by L3 Displays.
引用
收藏
页码:305 / 308
页数:4
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