Heat Transfer in Thermoelectric Materials and Devices

被引:118
|
作者
Tian, Zhiting [1 ]
Lee, Sangyeop [1 ]
Chen, Gang [1 ]
机构
[1] MIT, Dept Mech Engn, Cambridge, MA 02139 USA
来源
关键词
heat transfer; thermoelectric; nanostructuring; phonon transport; electron transport; thermal conductivity; LATTICE THERMAL-CONDUCTIVITY; FIGURE-OF-MERIT; MOLECULAR-DYNAMICS SIMULATION; FILLED SKUTTERUDITE ANTIMONIDES; MEAN FREE-PATH; PHONON-SCATTERING; TRANSPORT-PROPERTIES; SINGLE-CRYSTAL; TEMPERATURE PROPERTIES; IRREVERSIBLE-PROCESSES;
D O I
10.1115/1.4023585
中图分类号
O414.1 [热力学];
学科分类号
摘要
Solid-state thermoelectric devices are currently used in applications ranging from thermocouple sensors to power generators in space missions, to portable air-conditioners and refrigerators. With the ever-rising demand throughout the world for energy consumption and CO2 reduction, thermoelectric energy conversion has been receiving intensified attention as a potential candidate for waste-heat harvesting as well as for power generation from renewable sources. Efficient thermoelectric energy conversion critically depends on the performance of thermoelectric materials and devices. In this review, we discuss heat transfer in thermoelectric materials and devices, especially phonon engineering to reduce the lattice thermal conductivity of thermoelectric materials, which requires a fundamental understanding of nanoscale heat conduction physics.
引用
收藏
页数:15
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