Superhydrophobic Nickel Films Fabricated by Electro/Electroless Deposition

被引：0

作者：

Tian, Feifei ^{[1
]}

Hu, Anmin ^{[1
]}

Li, Ming ^{[1
]}

Mao, Dali ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, State Key Lab Met Matrix Composites, Shanghai 200240, Peoples R China

来源：

2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) | 2011年

关键词：

ELECTROCHEMICAL DEPOSITION; SURFACES; WETTABILITY; DROPLETS; COPPER;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Superhydrophobic nickel films were prepared by electrodeposition and electroless deposition without chemical modification. Experimental results reveal that the nickel film fabricated by electrodeposition is characterized with nanocone arrays and only has a contact angle of about 112o. By coupling electroless deposition, as the second step, hemispherically topped nanocones are generated and a high contact angle as much as 152.3o is obtained; that is, nickel surface has successfully transformed from hydrophobic to superhydrophobic.

引用

页码：175 / 177

页数：3

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