Thermal performance of a PCB channel heat sink for LED light bulbs

被引:16
作者
Jang, Daeseok [1 ]
Park, Seung-Jae [1 ]
Lee, Kwan-Soo [1 ]
机构
[1] Hanyang Univ, Sch Mech Engn, Seoul 133791, South Korea
关键词
LED bulb; Light-emitting diode (LED) lighting cooling; Printed circuit board (PCB) heat sink; Natural convection; CONVECTION; RADIATION;
D O I
10.1016/j.ijheatmasstransfer.2015.06.027
中图分类号
O414.1 [热力学];
学科分类号
摘要
In this study, the thermal performance of the printed circuit board (PCB) as a heat sink for the light-emitting diode (LED) bulb is analyzed. Cooling air is drawn through the bottom inlet of a case and exchanges heat from a vertically aligned PCB acting as a heat sink fin. The air then exits through a top outlet. Cooling performance is improved by arranging parallel PCBs to form a channel. Heat transfer is optimized by balancing cooling airflow rates on external and internal PCB surfaces, thereby reducing thermal resistance by 30% compared to previous designs. Cooling performance according to installation angle is investigated. The orientation effect on this channel design is determined to be 10% less than that of the reference design. Finally, the effect of PCB channel cooling performance on the LED bulb's life span is analyzed and shown to be 40% longer than that of the existing geometry. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1290 / 1296
页数:7
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