Diffusion of Cu and interfacial reactions during reflow of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga alloy on Ni/Cu substrate

被引：8

作者：

Mittal, Jagjiwan ^{[1
]}

Lin, Kwang Lung ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 701, Taiwan

来源：

JOURNAL OF MATERIALS RESEARCH | 2012年 / 27卷 / 08期

关键词：

INTERMETALLIC COMPOUND FORMATION; ZN SOLDER JOINTS; SN-ZN; PHASE-EQUILIBRIA; AG SOLDER; AL SOLDER; MICROSTRUCTURE; EVOLUTION; SYSTEM; GROWTH;

D O I：

10.1557/jmr.2012.68

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Reflow behavior of a Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga (five-element) solder on the Ni/Cu substrate was investigated under different heating rates. Reflowed samples show decreased Zn and increased AgZn3 in the solder with a reduction in the heating rate. The Zn at the solder/substrate interface was found to be much lower than that in the Sn-Zn solder systems. Cu was observed to be diffused through the electroplated Ni layer and noticed only with the Ag-Zn compound in the solder. Ga was spotted at the interface in the Ag-Zn matrix, whereas Al was detected with the Zn at the interface. Small intermetallic compound (IMC) layer was formed at the interface; however, its amount enhanced with the reduction in the heating rate. Present study relates the reflow behavior of the five-element solder with the reactivity of different elements in the system and its influence on the formation of IMCs in the solder and at the solder/substrate interface.

引用

页码：1142 / 1148

页数：7

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