OM4 bend insensitive multi-mode fibers' usefulness for MCM integration

被引：2

作者：

Guzowski, Bartlomiej ^{[1
]}

Lisik, Zbigniew ^{[1
]}

Tosik, Grzegorz ^{[1
]}

Ciupa, Emilia ^{[1
]}

机构：

[1] Tech Univ Lodz, Dept Semicond & Optoelect Devices, PL-90924 Lodz, Poland

来源：

MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS | 2012年 / 177卷 / 15期

关键词：

Optical fibers; Losses of optical fiber; Bending optical fibers; Impact of high temperatures on MM fibers; OM4; fibers;

D O I：

10.1016/j.mseb.2012.03.023

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

For future generations of electronic systems, a severe bottleneck is expected on the interconnection level and the use of optical interconnection is considered as one of the most promising solutions in this matter. Recent progress in fiber development resulted in new generation of optical fibers that are bend insensitive. This makes them ideal for Multi Chip Module (MCM) application. This paper focuses on OM4 bend insensitive multi-mode fibers' usefulness for MCM integration, particularly the investigation of MM fiber loss is presented, which is influenced by bend diameter and the fiber's mechanical performance under influence of high temperature (400 degrees C-1000 degrees C adequate to MCM production process). (C) 2012 Elsevier B.V. All rights reserved.

引用

页码：1367 / 1372

页数：6

共 13 条

[1]

Anderson D.R., 2004, TROUBLESHOOTING OPTI

[2] Fully embedded board-level guided-wave optoelectronic interconnects [J].

Chen, RT ;

Lin, L ;

Choi, C ;

Liu, YJJ ;

Bihari, B ;

Wu, L ;

Tang, SN ;

Wickman, R ;

Picor, B ;

Hibbs-Brenner, MK ;

Bristow, J ;

Liu, YS .

PROCEEDINGS OF THE IEEE, 2000, 88 (06) :780-793

[3]

Crisp J., 2005, Introduction to Fiber Optics, V3rd

[4] Prospects of a polymer-waveguide-based board-level optical interconnect technology [J].

Dangel, R. ;

Berger, C. ;

Beyeler, R. ;

Dellmann, L. ;

Horst, F. ;

Lamprecht, T. ;

Meier, N. ;

Offrein, B. J. .

2007 IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS, 2007, :131-134

[5]

Guzowski B, 2010, INT PHD WORKSH OWD P

[6]

Keiser G., 2004, OPTICAL COMMUNICATIO

[7]

Liu Y.S, 1998, IEEE CIRCUITS DEVICE

[8]

Mitschke F, 2009, FIBER OPTICS: PHYSICS AND TECHNOLOGY, P1

[9] High-Bandwidth, Chip-Based Optical Interconnects on Waveguide-Integrated SLC for Optical Off-Chip I/O [J].

Nakagawa, Shigeru ;

Taira, Yoichi ;

Numata, Hidetoshi ;

Kobayashi, Kaoru ;

Terada, Kenji ;

Fukui, Masahiro .

2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, :2086-+

[10] SLC-Based Optical Interconnect for Computing Systems [J].

Nakagawa, Shigeru ;

Taira, Yoichi ;

Numata, Hidetoshi ;

Kobayashi, Kaoru ;

Terada, Kenji ;

Tsukada, Yutaka .

IEEE 9TH VLSI PACKAGING WORKSHOP IN JAPAN, 2008, :13-+

← 1 2 →