共 19 条
[1]
[Anonymous], [No title captured]
[3]
Experimental investigation of an enhanced thermosyphon heat loop for cooling of a high performance electronics module
[J].
FIFTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1999,
:1-9
[5]
Franken A., 2010, HARVARD BUSINESS NOV, P1
[6]
GARNER SD, 2001, P INT EL PACK TECHN
[10]
ITA, 1981, HEAT PIPES PERFORMA