Influence of Low Temperature on Tensile Properties and Fracture Behavior of Sn3Ag0.5Cu Solder Alloy

被引：0
作者：
Tian, Ruyu [1 ]
Tian, Yanhong [1 ]
Wang, Chenxi [1 ]
机构：
[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin, Peoples R China
来源：
2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2016年
关键词：
tensile properties; fracture behavior; low temperature; solder alloy; STRAIN-RATE;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The tensile response and fracture surface of the lead-free Sn3Ag0.5Cu solder alloys were investigated at the strain rates of 0.001 s-1 over the temperature range from-150 C to 20 C. The ultimate tensile strength and yield strength of Sn3Ag0.5Cu increased almost linearly with decreasing temperature. The fracture behavior of Sn3Ag0.5Cu varied from ductile to brittle as the ambient temperature decreased to-150 C, which could be attributed to the asymmetric tetragonal structure of I3-Sn which is the main constituent of Sn3Ag0.5Cu solder alloy.
引用
收藏
页码：116 / 118
页数：3
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