Structure properties of Cu-Ni alloys at the rapid cooling rate using embedded-atom method

被引:21
|
作者
Cong, HR
Bian, XF
Zhang, JX
Li, H
机构
[1] Shandong Univ, Minist Educ, Key Lab Liquid Struct & Hered Mat, Jinan 250061, Peoples R China
[2] Nanjing Univ, Dept Phys, Nanjing 210093, Peoples R China
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2002年 / 326卷 / 02期
基金
中国国家自然科学基金;
关键词
EAM potential; molecular dynamics; rapid solidification;
D O I
10.1016/S0921-5093(01)01527-1
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The structure evolution in Cu-Ni alloys with different contents of Cu and Ni is studied at the cooling rate of 4 x 10(14) K s-(1) by means of the embedded-atom method based on molecular dynamics simulation, Techniques such as pair correction function, pair analysis technique, bond orientation order and diffusion coefficient are used to reveal the structural features of Cu-Ni alloy in the process of the rapid solidification from 1573 to 300 K It is found that there exists the chemical short-range order and topology short-range order in Cu-Ni alloy. The simulation also shows that Cu-Ni alloys, other than Cu20Ni80, form the amorphous structure while Cu20Ni80 alloy forms h.c.p. crystalline structure at the above cooling rate. (C) 2002 Elsevier Science B.V. All rights reserved.
引用
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页码:343 / 347
页数:5
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