The influence of interface bonding on thermal transport through solid-liquid interfaces

被引：105

作者：

Harikrishna, Hari ^{[1
]}

Ducker, William A. ^{[2
]}

Huxtable, Scott T. ^{[3
]}

机构：

[1] Virginia Tech, Dept Engn Sci & Mech, Blacksburg, VA 24061 USA

[2] Virginia Tech, Dept Chem Engn, Blacksburg, VA 24061 USA

[3] Virginia Tech, Dept Mech Engn, Blacksburg, VA 24061 USA

来源：

APPLIED PHYSICS LETTERS | 2013年 / 102卷 / 25期

关键词：

GOLD;

D O I：

10.1063/1.4812749

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We use time-domain thermoreflectance to show that interface thermal conductance, G, is proportional to the thermodynamic work of adhesion between gold and water, W-SL, for a series of five alkane-thiol monolayers at the gold-water interface. W-SL is a measure of the bond strength across the solid-liquid interface. Differences in bond strength, and thus differences in W-SL, are achieved by varying the terminal group (omega-group) of the alkane-thiol monolayers on the gold. The interface thermal conductance values were in the range 60-190 MW m(-2) K-1, and the solid-liquid contact angles span from 25 degrees to 118 degrees. (C) 2013 AIP Publishing LLC.

引用

页数：4

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