In Situ Surface X-Ray Diffraction Studies of the Influence of the PEG-Cl-Complex on Homoepitaxial Electrodeposition on Cu(001)

被引:10
作者
Golks, F. [1 ,2 ]
Gruender, Y. [1 ]
Druenkler, A. [1 ]
Roy, J. [2 ]
Stettner, J. [1 ]
Zegenhagen, J. [2 ]
Magnussen, O. M. [1 ]
机构
[1] Univ Kiel, Inst Expt & Angew Phys, D-24098 Kiel, Germany
[2] European Synchrotron Radiat Facil, F-38000 Grenoble, France
关键词
POLYETHYLENE-GLYCOL; CU(100) ELECTRODES; COPPER; CHLORIDE; DEPOSITION; ADSORPTION; ADDITIVES; CHEMISTRY; SYSTEM; BATH;
D O I
10.1149/2.027312jes
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The influence of polyethylene glycol (PEG) on the atomic-scale interface structure and Cu growth behavior of Cu(001) in chloride-containing electrolyte was investigated by in situ surface X-ray diffraction. Studies in Cu-free solution unambiguously verify the presence of the ordered c(2 x 2) chloride adlayer in the presence of the polymer as well as reversible Cl adsorption/desorption and an order-disorder transition in the adlayer. The partially ordered chloride adlayer is found over a wider potential range as compared to PEG-free electrolyte, indicating stabilization of this adsorbate phase. Crystal truncation and superstructure rod measurements reveal that the polymer interacts more strongly with the partially c(2 x 2) Cl covered surface than with the close-packed c(2 x 2) adlayer at saturation coverage. In Cu-containing electrolyte layer-by-layer growth was observed at potentials <=-0.35 V vs. Ag/AgCl. The deposition rate was significantly reduced as compared to PEG-free electrolyte, providing clear evidence of inhibition on the atomic-scale. At more positive potentials a crossover to 3D growth and increasing surface roughness is found. (C) 2013 The Electrochemical Society. All rights reserved.
引用
收藏
页码:D3165 / D3170
页数:6
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