AeroMEMS wall hot-wire anemometer on polyimide foil for measurement of high frequency fluctuations

被引:6
作者
Buder, U [1 ]
Berns, A [1 ]
Obermeier, E [1 ]
Petz, R [1 ]
Nitsche, W [1 ]
机构
[1] Tech Univ Berlin, D-1000 Berlin, Germany
来源
2005 IEEE SENSORS, VOLS 1 AND 2 | 2005年
关键词
D O I
10.1109/ICSENS.2005.1597756
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Design, simulation, manufacturing, calibration, and basic characterization of a M EMS wall hot-wire anemometer is presented. A highly sensitive nickel thin film resistor spanning a reactive ion etched cavity in a polyimide foil is employed. This sensor is the first in literature to feature both a thermally insulating cavity and a flexible base material. The polyimide base material allows adopting of the sensor to aerodynamic surfaces, e.g. airfoils and turbine blades. A mismatch of curvature of aerodynamic surface and silicon sensor surface, as observed with previously presented MEMS hot-wire anemometers, is avoided. The combination of polyimide's low thermal conductivity and a cavity featuring FEM-optimized dimensions accounts for a very low power consumption (< 30 mW). Fluctuations in wall shear stress up to 80 kHz can be resolved in constant-temperature mode. An average sensitivity of 0.44 V / (N/m(2)) is achieved in a wall shear stress range from 0 to 0.25 N/m(2).
引用
收藏
页码:545 / 548
页数:4
相关论文
共 8 条
[1]   TEMPERATURE COEFFICIENTS OF RESISTANCE OF METALLIC FILMS IN THE TEMPERATURE RANGE 25-DEGREES-C TO 600-DEGREES-C [J].
BELSER, RB ;
HICKLIN, WH .
JOURNAL OF APPLIED PHYSICS, 1959, 30 (03) :313-322
[2]  
BUDER U, 2005, P 19 EUR BARC SPAIN
[3]   FREQUENCY-RESPONSE AND ELECTRONIC TESTING FOR CONSTANT-TEMPERATURE HOT-WIRE ANEMOMETERS [J].
FREYMUTH, P .
JOURNAL OF PHYSICS E-SCIENTIFIC INSTRUMENTS, 1977, 10 (07) :705-710
[4]  
GADELHAK M, FLOW CONTROL, P13
[5]   THERMAL CONDUCTIVITY OF SILICON + GERMANIUM FROM 3 DEGREES K TO MELTING POINT [J].
GLASSBRENNER, CJ ;
SLACK, GA .
PHYSICAL REVIEW, 1964, 134 (4A) :1058-+
[6]   Effects of epitaxial lift-off on the DC, RF, and thermal properties of MESFET's on various host materials [J].
Morf, T ;
Biber, C ;
Bachtold, W .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1998, 45 (07) :1407-1413
[7]  
PELTZER I, 2003, RECENT RESULTS LAMIN, P269
[8]  
Tsao T, 1999, MICROENGINEERING AEROSPACE SYSTEMS, P553