Electrodeposition of Sn and Au-Sn alloys from a single non-cyanide electrolyte

被引：5
|
作者：
He, A. [1 ]
Ivey, D. G. [1 ]
机构：
[1] Univ Alberta, Dept Chem & Mat Engn, Edmonton, AB T6G 2V4, Canada
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2012年 / 23卷 / 12期
基金：
加拿大自然科学与工程研究理事会;
关键词：
GOLD; FABRICATION; STABILITY; SOLDER; BATH; TIN;
D O I：
10.1007/s10854-012-0748-z
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, it is demonstrated that Sn and Au-Sn alloys can be electrodeposited from a single non-cyanide electrolyte. This electrolyte consists of KAuCl4 center dot xH(2)O, SnCl2 center dot 2H(2)O, sodium sulfite (Na2SO3), tri-ammonium citrate and Triton X-100. The Sn is electrodeposited at a current density of 4 mA/cm(2) or higher, while the Au-rich intermetallic (Au5Sn) is electrodeposited at lower current densities (0.8-1.5 mA/cm(2)). Microstructural analysis shows that the deposits are uniform and smooth. If the deposits are plated at current densities from 2 to 4 mA/cm(2), which corresponds to a composition range of 30-80 at% Sn, multiple phases co-exist in the deposits.
引用
收藏
页码：2186 / 2193
页数：8
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