N-polar GaN epitaxy and high electron mobility transistors

被引:194
作者
Wong, Man Hoi [1 ,2 ]
Keller, Stacia [1 ,2 ]
Nidhi, Sansaptak Dasgupta [1 ,2 ]
Denninghoff, Daniel J. [1 ,2 ]
Kolluri, Seshadri [1 ,2 ]
Brown, David F. [1 ,2 ]
Lu, Jing [1 ,2 ]
Fichtenbaum, Nicholas A. [1 ,2 ]
Ahmadi, Elaheh [1 ,2 ]
Singisetti, Uttam [3 ]
Chini, Alessandro [4 ]
Rajan, Siddharth [5 ]
DenBaars, Steven P. [1 ,2 ]
Speck, James S. [1 ,2 ]
Mishra, Umesh K. [1 ,2 ]
机构
[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
[2] Univ Calif Santa Barbara, Dept Mat, Santa Barbara, CA 93106 USA
[3] SUNY Buffalo, Dept Elect Engn, Buffalo, NY 14260 USA
[4] Univ Modena & Reggio Emilia, Dept Informat Engn, Modena, Italy
[5] Ohio State Univ, Dept Elect & Comp Engn, Columbus, OH 43210 USA
基金
美国国家科学基金会;
关键词
MOLECULAR-BEAM EPITAXY; VAPOR-PHASE EPITAXY; FIELD-EFFECT TRANSISTORS; GAIN CUTOFF FREQUENCY; C-PLANE SAPPHIRE; ALGAN/GAN HEMTS; FACE GAN; THIN-FILMS; IMPURITY INCORPORATION; DISLOCATION REDUCTION;
D O I
10.1088/0268-1242/28/7/074009
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reviews the progress of N-polar (000 (1) over bar) GaN high frequency electronics that aims at addressing the device scaling challenges faced by GaN high electron mobility transistors (HEMTs) for radio-frequency and mixed-signal applications. Device quality (Al, In, Ga)N materials for N-polar heterostructures are developed using molecular beam epitaxy and metalorganic chemical vapor deposition. The principles of polarization engineering for designing N-polar HEMT structures will be outlined. The performance, scaling behavior and challenges of microwave power devices as well as highly-scaled depletion- and enhancement-mode devices employing advanced technologies including self-aligned processes, n+ (In, Ga)N ohmic contact regrowth and high aspect ratio T-gates will be discussed. Recent research results on integrating N-polar GaN with Si for prospective novel applications will also be summarized.
引用
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页数:22
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