Geometry optimization for planar piezoresistive stress sensors based on the pseudo-Hall effect

被引:35
作者
Doelle, M [1 ]
Mager, D [1 ]
Ruther, P [1 ]
Paul, O [1 ]
机构
[1] Univ Freiburg, MML, Inst Microsyst Technol IMTEK, D-79110 Freiburg, Germany
关键词
stress sensors; piezoresistance; Pseudo-Hall effect; Piezo-FET; CMOS; sensitivity;
D O I
10.1016/j.sna.2005.08.014
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The dependence of the sensitivity of planar piezoresistive stress sensors on geometry is systematically analyzed. The sensors in this paper are based on the shear piezoresistance effect, also termed pseudo-Hall effect. The analyzed geometry parameters are: (i) the shape of the device active area, (ii) its aspect ratio and (iii) the location and size of input and output contacts. Further, the influence of non-conducting islands in the active device area was investigated. General design rules for the design of piezoresistive stress sensors with improved sensitivity were extracted. These results were obtained using a simulation approach combining affine mapping with the finite element method. The simulation program was tested by comparing simulation results with experimental data obtained from stress sensors fabricated in CMOS technology. The differences between simulated and measured results were between 1.2 and 3.3%. Novel optimized sensor geometries with non-conducting islands show simulated and measured sensitivities greatly improved by factors up to 2.30 and 2.39, respectively. Further, the new sensors with non-conducting islands are put in perspective with classical Wheatstone bridges. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码:261 / 269
页数:9
相关论文
共 23 条
[1]   Integrated atomic force microscopy array probe with metal-oxide-semiconductor field effect transistor stress sensor, thermal bimorph actuator, and on-chip complementary metal-oxide-semiconductor electronics [J].
Akiyama, T ;
Staufer, U ;
de Rooij, NF ;
Lange, D ;
Hagleitner, C ;
Brand, O ;
Baltes, H ;
Tonin, A ;
Hidber, HR .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2000, 18 (06) :2669-2675
[2]   Multidimensional CMOS in-plane stress sensor [J].
Bartholomeyczik, J ;
Brugger, S ;
Ruther, P ;
Paul, O .
IEEE SENSORS JOURNAL, 2005, 5 (05) :872-882
[3]  
DEMEY G, 1983, ADV ELECTRON EL PHYS, V61, P1
[4]  
DOELLE M, 2005, IEEE MEMS C JAN 31 F
[5]  
DOELLE M, 2004, IEEE MEMS C JAN 25 2
[6]  
DOELLE M, 2003, P IEEE MEMS C JAN 19
[7]  
Driscoll T., 2002, Schwarz-Christoffel Mapping
[8]   Improved design of a silicon micromachined gyroscope with piezoresistive detection and electromagnetic excitation [J].
Grétillat, F ;
Grétillat, MA ;
de Rooij, NF .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1999, 8 (03) :243-250
[9]  
HAEUSLER J, 1966, J SOLID STATE ELECTR, V9, P417
[10]   CMOS INTEGRATED SILICON PRESSURE SENSOR [J].
ISHIHARA, T ;
SUZUKI, K ;
SUWAZONO, S ;
HIRATA, M ;
TANIGAWA, H .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1987, 22 (02) :151-156