Simulation of uniaxial tensile properties for lead-free solders with modified Anand model

被引：88

作者：

Bai, Ning ^{[1
]}

Chen, Xu ^{[1
]}

Gao, Hong ^{[1
]}

机构：

[1] Tianjin Univ, Sch Chem Engn & Technol, Tianjin 300072, Peoples R China

来源：

MATERIALS & DESIGN | 2009年 / 30卷 / 01期

关键词：

Brazing and soldering; Mechanical; Material property databases; STRESS-STRAIN RELATIONSHIP; CONSTITUTIVE MODEL; BEHAVIOR;

D O I：

10.1016/j.matdes.2008.04.032

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The uniaxial tensile inelastic deformation behavior for three types of lead-free solders, 5n-3Ag-0.5Cu, Sn-3.5Ag and Sn-0.71Zu, were simulated by a unified viscoplastic constitutive model, the Anand model. To obtain the material parameters for the Anand model, a series of constant true strain rate and temperature tests were conducted on three types of lead-free solders at various strain rates from 1 x 10(-4) s(-1) to 1 x 10(-2) s(-1), over a wide temperature range from 25 degrees C to 150 degrees C. A modified Anand model, in which h(0) was set to a function of strain rate, was proposed. The comparison of the experimental and simulated results showed that the modified Anand model improved the simulation capability. (C) 2008 Elsevier Ltd. All rights reserved.

引用

页码：122 / 128

页数：7

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