Simulation of an Aluminum Thick Wire Bond Fatigue Crack by Means of the Cohesive Zone Method

被引：0

作者：

Grams, Arian ^{[1
]}

Prewitz, Tobias ^{[1
]}

Wittler, Olaf ^{[1
]}

Kripfgans, Johannes ^{[1
]}

Schmitz, Stefan ^{[1
]}

Middendorf, Andreas ^{[1
]}

Mueller, Wolfgang H.

Lang, Klaus-Dieter

机构：

[1] Fraunhofer IZM, D-13355 Berlin, Germany

来源：

2013 14TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME) | 2013年

关键词：

MODEL; GROWTH;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this study possibilities are investigated to use the cohesive zone method for numerical calculation of fatigue crack growth through the interface area of aluminum thick wire bond joints. For that purpose a detailed three-dimensional model of a wire bond joint is built. Two approaches are investigated to describe the fatigue crack growth: explicit calculation of a large number of cycles and crack growth prediction using a crack growth law like the Paris' law. Both methods are shown to be theoretically feasible and challenges and limits of the cohesive zone method are described.

引用

页数：8

共 25 条

[1] Fatigue damage modeling in solder interconnects using a cohesive zone approach [J].