A novel prototyping method for die-level monolithic integration of MEMS above-IC

被引：8

作者：

Cicek, Paul-Vahe ^{[1
]}

Zhang, Qing ^{[1
]}

Saha, Tanmoy ^{[1
]}

Mahdavi, Sareh ^{[1
]}

Allidina, Karim ^{[1
]}

Nabki, Frederic ^{[2
]}

El Gamal, Mourad ^{[1
]}

机构：

[1] McGill Univ, Dept Elect Engn, Wireless ICs & MEMS Lab, Montreal, PQ, Canada

[2] Univ Quebec, Dept Comp Sci, CoFaM Res Ctr, Montreal, PQ H3C 3P8, Canada

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2013年 / 23卷 / 06期

基金：

加拿大自然科学与工程研究理事会;

关键词：

SILICON-CARBIDE; SYSTEMS;

D O I：

10.1088/0960-1317/23/6/065013

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This work presents a convenient and versatile prototyping method for integrating surface-micromachined microelectromechanical systems (MEMS) directly above IC electronics, at the die level. Such localized implementation helps reduce development costs associated with the acquisition of full-sized semiconductor wafers. To demonstrate the validity of this method, variants of an IC-compatible surface-micromachining MEMS process are used to build different MEMS devices above a commercial transimpedance amplifier chip. Subsequent functional assessments for both the electronics and the MEMS indicate that the integration is successful, validating the prototyping methodology presented in this work, as well as the suitability of the selected MEMS technology for above-IC integration.

引用

页数：9

共 25 条

[1]

Abadal G., 2008, INTEGRATION ISSUES M, P1

[2] Microsensor integration into systems-on-chip [J].

Brand, Oliver .

PROCEEDINGS OF THE IEEE, 2006, 94 (06) :1160-1176

[3] Integrating microelectromechanical systems with integrated circuits [J].

Bryzek, J ;

Flannery, A ;

Skurnik, D .

IEEE INSTRUMENTATION & MEASUREMENT MAGAZINE, 2004, 7 (02) :51-59

[4]

Busquere J., 2005, Microwave Conference Proceedings, P4

[5] Design and characterization of an air-coupled capacitive ultrasonic sensor fabricated in a CMOS process [J].

Chen, Meng-Hui ;

Lu, Michael S-C .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2008, 18 (01)

[6]

Cicek P.-V, 2009, 2009 16th IEEE International Conference on Electronics, Circuits and Systems (ICECS 2009), P223, DOI 10.1109/ICECS.2009.5410976

[7] Design of a Low-Cost MEMS Monolithically-Integrated Relative Humidity Sensor [J].

Cicek, Paul-Vahe ;

Saha, Tanmoy ;

Waguih, Bichoy ;

Nabki, Frederic ;

El-Gamal, Mourad N. .

2010 INTERNATIONAL CONFERENCE ON MICROELECTRONICS, 2010, :172-175

[8] Technologies for cofabricating MEMS and electronics [J].

Fedder, Gary K. ;

Howe, Roger T. ;

Liu, Tsu-Jae King ;

Quevy, Emmanuel P. .

PROCEEDINGS OF THE IEEE, 2008, 96 (02) :306-322

[9] A MEMS-first fabrication process for integrating CMOS circuits with polysilicon microstructures [J].

Gianchandani, YB ;

Kim, H ;

Shinn, M ;

Ha, B ;

Lee, B ;

Najafi, K ;

Song, C .

MICRO ELECTRO MECHANICAL SYSTEMS - IEEE ELEVENTH ANNUAL INTERNATIONAL WORKSHOP PROCEEDINGS, 1998, :257-262

[10] Fracture toughness of low-pressure chemical-vapor-deposited polycrystalline silicon carbide thin films [J].

Hatty, V ;

Kahn, H ;

Trevino, J ;

Zorman, CA ;

Mehregany, M ;

Ballarini, R ;

Heuer, AH .

JOURNAL OF APPLIED PHYSICS, 2006, 99 (01)

← 1 2 3 →