Thermal stability and electrical properties of Ag-Ti films and Ti/Ag/Ti films prepared by sputtering

被引：25
作者：
Kawamura, M. [1 ]
Zhang, Z. [1 ]
Kiyono, R. [1 ]
Abe, Y. [1 ]
机构：
[1] Kitami Inst Technol, Dept Mat Sci & Engn, Kitami, Hokkaido 0908507, Japan
来源：
VACUUM | 2013年 / 87卷
基金：
日本学术振兴会;
关键词：
Ag-Ti alloy film; Ti/Ag/Ti multilayered film; Agglomeration suppression; Surface morphology; Resistivity; THIN-FILMS;
D O I：
10.1016/j.vacuum.2012.02.021
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Ag-Ti (100 nm) alloy film, and Ti/Ag (100 nm) double-layer and Ti/Ag (100 nm)/Ti triple-layer films were prepared by rf sputtering to investigate the effect of Ti on suppression of agglomeration of the Ag thin film caused by thermal treatment. Scanning electron microscopy revealed that the Ag-Ti and Ti/Ag/Ti films had high thermal stability. X-ray photoelectron spectroscopy analysis showed that the surfaces of both kinds of films were covered with a TiO2 layer after annealing, which was considered to be the key factor for improvement of the thermal stability of the films. In addition, scratch tests indicated improvement of the adhesive strength of the Ti/Ag/Ti film to the SiO2 substrate due to the underlying Ti film layer, which effectively promoted suppression of Ag agglomeration. However, the resistivity of the Ag Ti films increased abruptly with increasing Ti content due to the impurity scattering effect, and minimum usage of the alloying element was required to achieve low resistivity. In contrast, the Ti/Ag/Ti film exhibited both low resistivity and high thermal stability. (C) 2012 Elsevier Ltd. All rights reserved.
引用
收藏
页码：222 / 226
页数：5
相关论文
共 12 条
  • [1] Stability of silver thin films on various underlying layers at elevated temperatures
    Alford, TL
    Chen, LH
    Gadre, KS
    [J]. THIN SOLID FILMS, 2003, 429 (1-2) : 248 - 254
  • [2] [Anonymous], 1983, B ALLOY PHASE DIAGR, DOI DOI 10.1007/BF02884876
  • [3] Chastain J, 1992, HDB XRAY PHOTOELECTR, P231
  • [4] Thermally stable very thin Ag films for electrodes
    Kawamura, M.
    Fukuda, D.
    Inami, Y.
    Abe, Y.
    Sasaki, K.
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2009, 27 (04): : 975 - 978
  • [5] Thermally Stable Ag Thin Films Modified with Very Thin Al Oxide layers
    Kawamura, Midori
    Inami, Yuuki
    Abe, Yoshio
    Sasaki, Katsutaka
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS, 2008, 47 (12) : 8917 - 8920
  • [6] Comparison of texture evolution in Ag and Ag(Al) alloy thin films on amorphous SiO2
    Kim, HC
    Theodore, ND
    Alford, TL
    [J]. JOURNAL OF APPLIED PHYSICS, 2004, 95 (09) : 5180 - 5188
  • [7] Lide D.R., 2003, HDB CHEM PHYS, P12
  • [8] Mashita M., 1998, HAKUMAKU KOGAKU HDB, P380
  • [9] Agglomeration suppression behavior and mechanisms of Ag-Cu and Ag-Nb thin films
    Minamide, Y.
    Kawamura, M.
    Abe, Y.
    Sasaki, K.
    [J]. VACUUM, 2009, 84 (05) : 657 - 662
  • [10] Comparison of the agglomeration behavior of Ag(Al) films and Ag(Au) films
    Sugawara, K.
    Kawamura, M.
    Abe, Y.
    Sasaki, K.
    [J]. MICROELECTRONIC ENGINEERING, 2007, 84 (11) : 2476 - 2480
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