Reliability-Oriented Automated Design of Double-Sided Cooling Power Module: A Thermo-Mechanical-Coordinated and Multi-Objective-Oriented Optimization Methodology

被引:16
作者
Zeng, Zheng [1 ]
Ou, Kaihong [1 ]
Wang, Liang [1 ]
Yu, Yue [1 ]
机构
[1] Chongqing Univ, State Key Lab Power Transmiss Equipment & Syst Se, Chongqing 400044, Peoples R China
关键词
Multichip modules; Thermomechanical processes; Thermal resistance; Cooling; Mathematical model; Reliability; Power module; double-sided cooling; automated design; multi-objective optimization; reliability-oriented thermalmechanical co-design; CAPABILITIES; FATIGUE; CELL;
D O I
10.1109/TDMR.2020.3012065
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Compared with the traditional single-sided cooling (SSC) power module, owing to the decreased thermal resistance and packaging parasitics, the double-sided cooling (DSC) power module is a promising solution of the motor drive for electric vehicle (EV) implementation. However, the lack of the model to characterize the thermo-mechanical interaction mechanism in the DSC power module challenges the co-design methodology of the power module from the respective of multi-physics. In this paper, aiming at reliability improvement, to balance the tradeoff between thermal resistance and mechanical stress, a multi-objective-coordinated automated design methodology is proposed for the DSC power module. To characterize the influences of material properties and structure sizes, the mathematical models for the thermal and mechanical features of the DSC power module are proposed. These models are also examined by using the finite element analysis (FEA) tool. Besides, to promote the specifications of DSC power module, a multi-objective optimization model is proposed to coordinate thermo-mechanical metrics in multi-physics. The non-dominated sorting genetic algorithm II (NSGA-II) is implemented to automatically achieve the Pareto solutions of the proposed multi-objective optimization model with respect to thermal resistance and mechanical stress. Considering the influences of material properties, optimal structure sizes of the DSC power module are comprehensively presented. The proposed multi-objective-oriented optimization methodology provides a new routine to reshape the thermo-mechanical performance of the next-generation DSC power module toward more reliable EV implementation.
引用
收藏
页码:584 / 595
页数:12
相关论文
共 52 条
  • [41] Reliability- and Cost-Based Redundancy Design for Modular Multilevel Converter
    Tu, Pengfei
    Yang, Shunfeng
    Wang, Peng
    [J]. IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2019, 66 (03) : 2333 - 2342
  • [42] A Bus-Bar-Like Power Module Based on Three-Dimensional Power-Chip-on-Chip Hybrid Integration
    Vagnon, Eric
    Jeannin, Pierre-Olivier
    Crebier, Jean-Christophe
    Avenas, Yvan
    [J]. IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2010, 46 (05) : 2046 - 2055
  • [43] Pressureless Silver Sintering on Nickel for Power Module Packaging
    Wang, Meiyu
    Mei, Yunhui
    Li, Xin
    Burgos, Rolando
    Boroyevich, Dushan
    Lu, Guo-Quan
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2019, 34 (08) : 7121 - 7125
  • [44] Comparison of IGBT Cycling Capabilities for Different AC/AC Topologies
    Wei, Lixiang
    Lipo, Thomas A.
    Lukaszewski, Richard A.
    [J]. IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2010, 46 (06) : 2475 - 2483
  • [45] Miniaturized Double Side Cooling Packaging for High Power 3 Phase SiC Inverter Module with Junction Temperature over 220 °C
    Woo, Daniel Rhee Min
    Yuan, Hwang How
    Li, Jerry Aw Jie
    Bum, Lee Jong
    Zhang Hengyun
    [J]. 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 1190 - 1196
  • [46] Electrical Performance Advancement in SiC Power Module Package Design With Kelvin Drain Connection and Low Parasitic Inductance
    Yang, Fei
    Wang, Zhiqiang
    Liang, Zhenxian
    Wang, Fei
    [J]. IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2019, 7 (01) : 84 - 98
  • [47] A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices
    Yin, Liang
    Kapusta, Christopher
    Gowda, Arun
    Nagarkar, Kaustubh
    [J]. JOURNAL OF ELECTRONIC PACKAGING, 2018, 140 (03)
  • [48] Stepwise Design Methodology and Heterogeneous Integration Routine of Air-Cooled SiC Inverter for Electric Vehicle
    Zeng, Zheng
    Zhang, Xin
    Blaabjerg, Frede
    Chen, Hao
    Sun, Tianfu
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2020, 35 (04) : 3973 - 3988
  • [49] Zhang H, 2013, IEEE ENER CONV, P2877, DOI 10.1109/ECCE.2013.6647075
  • [50] Zhao X, 2018, APPL POWER ELECT CO, P1266, DOI 10.1109/APEC.2018.8341179