Bump and Underfill Effects on Thermal Behaviors of Flip-Chip LED Packages: Measurement and Modeling

被引：25
|
作者：
Tsai, Ming-Yi [1 ]
Tang, Chung-Yi [1 ]
Yen, Chia-Yi [2 ]
Chang, Liann-Be [2 ]
机构：
[1] Chang Gung Univ, Dept Mech Engn, Tao Yuan 333, Taiwan
[2] Chang Gung Univ, Dept Elect Engn, Tao Yuan 333, Taiwan
来源：
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | 2014年 / 14卷 / 01期
关键词：
Flip chip (FC); junction temperature; light-emitting diode (LED); thermal resistance; LIGHT-EMITTING-DIODES; CONDUCTIVITY;
D O I：
10.1109/TDMR.2013.2248365
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The goal of this paper is to experimentally and numerically study the thermal behaviors of flip-chip (FC) light-emitting diode (LED) packages with and without underfills and, furthermore, to compare it with conventional wire-bonding LED packages in order to understand its thermal dissipation mechanism. In experimental analyses, the junction temperature T-j and surface temperatures are measured by a junction temperature tester, thermal couples, and an infrared thermal imager, whereas the numerical analysis is carried out by an ANSYS simulation. After the validation of the simulation model with experimental results, the effects of FC bump number and underfill thermal conductivity on both T-j and thermal resistance R-th of the packages are investigated by this validated model. Furthermore, a simple model of effective thermal conductivity for a composite material of bumps and underfills is proposed for thermal analysis of the FCLED packages. Thermal results for the packages are presented and discussed in terms of volume fraction and thermal conductivity for bumps and underfills in this paper.
引用
收藏
页码：161 / 168
页数：8
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