Wet etching of glass

被引：28
|
作者：
Iliescu, Ciprian [1 ]
Tay, Francis E. H. [1 ]
机构：
[1] Inst Bioengn & Nanotechnol, Singapore 138669, Singapore
来源：
CAS 2005: INTERNATIONAL SEMICONDUCTOR CONFERENCE | 2005年 / 1-2卷
关键词：
glass; wet etching; masking layers;
D O I：
10.1109/SMICND.2005.1558704
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The purpose of this paper is to find ways to improve the wet etching techniques used for glass etchin. Essential elements of glass wet etching process such as: influence of glass composition, etching rate, influence of the residual stress in the masking layer. characterization of the main masking materials, the quality of surface generated using wet etching process are analyzed. As a result of this analysis an improved technique for deep wet etching of glass is proposed. A 500-mu m thick Pyrex glass wafer was etched through using a Cr/Au and photoresist mask, from our knowledge this is the best result reported. For an improved surface an optimal solution HF/HCI (10:1) was established for Pyrex and soda lime glasses. The developed techniques are currently used for fabrication of microfluidic dei,ices on glass.
引用
收藏
页码：35 / 44
页数：10
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