Substrate integrated waveguides optimized for ultrahigh-speed digital interconnects

被引:47
|
作者
Simpson, Jamesina J. [1 ]
Taflove, Allen
Mix, Jason A.
Heck, Howard
机构
[1] Northwestern Univ, Dept Elect Engn & Comp Sci, Evanston, IL 60208 USA
[2] Intel Corp, Platform Technol Lab, Hillsboro, OR 97124 USA
基金
美国国家科学基金会;
关键词
finite-difference time-domain (FDTD) methods; multiprocessor interconnection; waveguide bends; waveguides;
D O I
10.1109/TMTT.2006.873622
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports an experimental and computational study of substrate integrated waveguides (SIWs) optimized for use as ultrahigh-speed bandpass waveguiding digital interconnects. The novelty of this study resides in our successful design, fabrication, and testing of low-loss SlWs that achieve 100% relative bandwidths via optimal excitation of the dominant TE10 mode and avoidance of the excitation of the TE20 mode. Furthermore, our optimal structures maintain their 100% relative bandwidth while transmitting around 45 degrees and 90 degrees bends, and achieve measured crosstalk of better than -30 dB over the entire passband. We consider SlWs operating at center frequencies of 50 GHz, accommodating in principle data rates of greater than 50 Gb/s. These SlWs are 35% narrower in the transverse direction and provide a 20% larger relative bandwidth than our previously reported electromagnetic bandgap waveguiding digital interconnects. Since existing circuit-board technology permits dimensional reductions of the SlWs by yet another factor of 4 : 1 relative to the ones discussed here, bandpass operation at center frequencies approaching 200 GHz with data rates of 200 Gb/s are feasible. These data rates meet or exceed those expected eventually for proposed silicon photonic technologies.
引用
收藏
页码:1983 / 1990
页数:8
相关论文
共 50 条
  • [1] Ultrahigh-Speed Optical Interconnects With Thin Film Lithium Niobate Modulator
    Fang, Xiansong
    Yang, Fan
    Chen, Xinyu
    Li, Yanping
    Zhang, Fan
    JOURNAL OF LIGHTWAVE TECHNOLOGY, 2023, 41 (04) : 1207 - 1215
  • [2] Ultrahigh-speed silicon-based modulators/photodetectors for optical interconnects
    Hu, Xiao
    Wu, Dingyi
    Zhang, Hongguang
    Chen, Daigao
    Wang, Lei
    Xiao, Xi
    Yu, Shaohua
    2023 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION, OFC, 2023,
  • [3] PROSPECTS FOR ULTRAHIGH-SPEED VLSI GAAS DIGITAL LOGIC
    EDEN, RC
    WELCH, BM
    ZUCCA, R
    LONG, SI
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1979, 26 (04) : 299 - 317
  • [4] PROSPECTS FOR ULTRAHIGH-SPEED VLSI GAAS DIGITAL LOGIC
    EDEN, RC
    WELCH, BM
    ZUCCA, R
    LONG, SI
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1979, 14 (02) : 221 - 239
  • [5] ULTRAHIGH-SPEED ROTATION
    BEAMS, JW
    SCIENTIFIC AMERICAN, 1961, 204 (04) : 135 - &
  • [6] FDTD Modeling Applications in Ultrahigh-Speed Interconnects and Electromagnetic Compatibility of Complex Packages
    Simpson, Jamesina J.
    2009 INTERNATIONAL MICROWAVE WORKSHOP SERIES ON SIGNAL INTEGRITY AND HIGH-SPEED INTERCONNECTS, 2009, : 5 - 8
  • [7] Ultrahigh-speed fiber-integrated semiconductor ring laser
    Kim, DH
    Kim, SH
    Jhon, YM
    Byun, YT
    Jo, JC
    Choi, SS
    OPTICS COMMUNICATIONS, 2000, 181 (4-6) : 385 - 390
  • [8] ULTRAHIGH-SPEED PHOTOGRAPHIC INSTRUMENTS
    HOLLAND, TE
    HEALEY, TJ
    BAGLEY, CH
    ISA TRANSACTIONS, 1966, 5 (01) : 5 - &
  • [9] PACING ULTRAHIGH-SPEED COMPUTERS
    RILEY, WB
    ELECTRONICS, 1968, 41 (05): : 165 - &
  • [10] ULTRAHIGH-SPEED MICROCHANNEL PHOTOMULTIPLIER
    BOUTOT, J
    PIETRI, G
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1970, ED17 (07) : 493 - +