A methodological approach for predictive reliability: Practical case studies

被引：3
作者：
Fremont, H. [1 ]
Duchamp, G. [1 ]
Gracia, A. [1 ]
Verdier, F. [1 ]
机构：
[1] Univ Bordeaux, IMS Lab, CNRS, IPB, F-33405 Talence, France
来源：
MICROELECTRONICS RELIABILITY | 2012年 / 52卷 / 12期
关键词：
MODEL;
D O I：
10.1016/j.microrel.2012.07.016
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The paper first describes challenges that engineers face in predicting the reliability of microelectronic assemblies. In addition, the constraints such as temperature, temperature cycle or moisture may interact with each other. So it is not feasible to solve the reliability problems without a methodological approach. The paper presents also case studies to illustrate a methodology combining experiments and simulations. (C) 2012 Elsevier Ltd. All rights reserved.
引用
收藏
页码：3035 / 3042
页数：8
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