Smart Adhesive Joints: An Overview of Recent Developments

被引：105

作者：

Banea, Mariana D. ^{[1
]}

da Silva, Lucas F. M. ^{[2
]}

Campilho, Raul D. S. G. ^{[3
]}

Sato, Chiaki ^{[4
]}

机构：

[1] Univ Porto, IDMEC, Fac Engn, P-4200465 Oporto, Portugal

[2] Univ Porto, Dept Engn Mecan, Fac Engn, P-4200465 Oporto, Portugal

[3] Inst Politecn Porto, Inst Super Engn Porto, Dept Engn Mecan, Oporto, Portugal

[4] Tokyo Inst Technol, Precis & Intelligence Lab, Tokyo 152, Japan

来源：

JOURNAL OF ADHESION | 2014年 / 90卷 / 01期

关键词：

Nanoparticles; Recycle; Repair; Self-healing materials; Smart adhesive joints; Thermally expandable particles; SELF-HEALING MATERIALS; MICROENCAPSULATED EPOXY; DELAMINATION DAMAGE; COMPOSITE; FRACTURE; STRENGTH; POLYMERS; REPAIR; TENSILE; MICROSPHERES;

D O I：

10.1080/00218464.2013.785916

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

Adhesive bonding is a viable technique for joining a wide range of materials. However, increasing the lifetime, reducing the costs, and improving the safety of structures are highly demanded nowadays. Hence, the development of new technologies and processes for easy recycle, heal, or self-heal of bonded structures are becoming of great interest for the industry. This paper provides an overview of the current developments in the use of smart adhesive technology and introduces the reader to early findings on the use of self-healing materials, thermally expandable particles, and nanoparticles, among others, in adhesives and their potential to increase the reliability of adhesive joints.

引用

页码：16 / 40

页数：25

共 101 条

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[2]

Alcorta J., 2005, Patent No. [WO2005028583A1, 2005028583]

[3]

Alcorta J, 2008, JEC COMPOS MAG, V45, P65

[4] Writing, Self-Healing, and Self-Erasing on Conductive Pressure-Sensitive Adhesives [J].