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- [33] 3D COMPUTATIONAL ANALYSIS OF THERMAL&HYDRAULIC PERFORMANCE OF LOUVERED FIN HEAT EXCHANGER WITH VARIABLE LOUVER ANGLE AND LOUVER PITCH PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 6B, 2017,
- [36] Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 541 - 547
- [38] System Performance Analysis of Bit-Alterable 3D NAND Flash Devices for High-Performance Solid-State Drive (SSD) Applications 2018 IEEE 10TH INTERNATIONAL MEMORY WORKSHOP (IMW), 2018, : 175 - 178