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- [5] Analysis of steady heat conduction for 3D axisymmetric functionally graded circular plate Journal of Central South University, 2013, 20 : 1616 - 1622
- [10] Thermal analysis of 3D functional partitioning for high-performance systems PROCEEDINGS OF THE TWENTIETH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2021), 2021, : 145 - 153