RELIABILITY EVALUATION OF FATIGUE LIFE FOR SOLDER JOINTS IN CHIP COMPONENTS CONSIDERING DISPERSION OF THE SHAPE AND THE PROPERTIES

被引:0
作者
Nishimura, Yuji [1 ]
Yu, Qiang [1 ]
机构
[1] Yokohama Natl Univ, Yokohama, Kanagawa 240, Japan
来源
PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1 | 2012年
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Recently, the downsizing of car components becomes a big trend for the development of car electronics, and it is becoming very difficult to achieve the reliability results target without managing controlling the dispersion of the fatigue lives. The authors proposed an isothermal fatigue test method using small size solder joints to get the fatigue properties. The Manson-Coffin's law given by this method could improve the correspondence between the simulation results and experimental results. Based upon the Manson-Coffin's law and Miner's law, the authors proposed a fatigue crack propagation simulation approach. Furthermore, in order to consider the heterogeneity of PCB due to the distribution of fiber network, the authors made heterogeneous model considering the distribution of the fiber. And the authors evaluated the fatigue life of solder joints in chip components with considering dispersion of the material properties by using the heterogeneous model.
引用
收藏
页码:191 / 194
页数:4
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