Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect

被引：21

作者：

Liu, H. Y. ^{[1
]}

Zhu, Q. S. ^{[1
]}

Wang, Z. G. ^{[1
]}

Guo, J. D. ^{[1
]}

Shang, J. K. ^{[1
,2
]}

机构：

[1] Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China

[2] Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2013年 / 24卷 / 01期

基金：

中国国家自然科学基金;

关键词：

INTERMETALLIC COMPOUND FORMATION; SN-3.8AG-0.7CU SOLDER; MICROSTRUCTURE; CU;

D O I：

10.1007/s10854-012-0714-9

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Effects of electromigration on microstructure and tensile property were studied in the Sn-1Ag-0.5Cu and Sn-1Ag-0.5Cu-1Zn solder interconnects. While the polarity effect and strength reduction from electromigration occurred in the Sn-1Ag-0.5Cu solder interconnects, they were suppressed by the Zn addition in the Sn-1Ag-0.5Cu-1Zn solder interconnects. Such a strong effect of Zn was explained by the strong binding of Zn with Cu, which prevented the dissolution of the IMC at the cathode, and by the reverse migration of the Zn elements, which counteracted the increase in the vacancy concentration so that the strength reduction was successfully inhibited.

引用

页码：211 / 216

页数：6

共 20 条

[1] STRESS GENERATION BY ELECTROMIGRATION [J].

BLECH, IA ;

HERRING, C .

APPLIED PHYSICS LETTERS, 1976, 29 (03) :131-133

[2] Failure mechanisms of solder interconnects under current stressing in advanced electronic packages [J].

Chan, Y. C. ;

Yang, D. .

PROGRESS IN MATERIALS SCIENCE, 2010, 55 (05) :428-475

[3] Effects of silver doping on electromigration of eutectic SnBi solder [J].

Chen, Chih-ming ;

Huang, Chih-chieh .

JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 461 (1-2) :235-241

[4] Current-induced phase partitioning in eutectic indium-tin pb-free solder interconnect [J].

Daghfal, John P. ;

Shang, J. K. .

JOURNAL OF ELECTRONIC MATERIALS, 2007, 36 (10) :1372-1377

[5] Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples [J].

Gan, H ;

Tu, KN .

JOURNAL OF APPLIED PHYSICS, 2005, 97 (06)

[6]

Hirth J.P., 1982, THEORY DISLOCATIONS, P556

[7] Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates [J].

Kotadia, H. R. ;

Mokhtari, O. ;

Bottrill, M. ;

Clode, M. P. ;

Green, M. A. ;

Mannan, S. H. .

JOURNAL OF ELECTRONIC MATERIALS, 2010, 39 (12) :2720-2731

[8] Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes [J].

Liu, CY ;

Chen, C ;

Liao, CN ;

Tu, KN .

APPLIED PHYSICS LETTERS, 1999, 75 (01) :58-60

[9] Enhanced stress relaxation of Sn-3.8Ag-0.7Cu solder by electrical current [J].

Liu, Haiyan ;

Zhu, Qingsheng ;

Zhang, Li ;

Wang, Zhongguang ;

Shang, Jian Ku .

JOURNAL OF MATERIALS RESEARCH, 2010, 25 (06) :1172-1178

[10] Electromigration induced ductile-to-brittle transition in lead-free solder joints [J].

Ren, Fei ;

Nah, Jae-Woong ;

Tu, K. N. ;

Xiong, Bingshou ;

Xu, Luhua ;

Pang, John H. L. .

APPLIED PHYSICS LETTERS, 2006, 89 (14)

← 1 2 →