Low temperature substrate transfer technique for 3D vertically aligned carbon nanotube architectures

The integration of aligned carbon nanotubes (CNTs) into microstructured device architectures is of utmost interest to bridge the gap between the nano and micro size regime. This can be achieved by bundling these nanostructures to larger micro-sized arrays of aligned CNTs. Device applications of such CNT array structures can be envisaged, e. g., in field emission, sensors or in sub-mu m vertical interconnect access application. However, high process temperatures which are typically used for the synthesis of CNTs are not always tolerable for an overall device integration process. Therefore, low temperature transfer techniques for as grown 3D aligned CNT arrays onto substrates different than the initial growth substrate are desirable. Here we propose a novel method to transfer 3D CNT block arrays containing vertically grown CNTs. The combination of flip-chip and micro-contact printing allows for a transfer of highly ordered CNT block arrays onto inorganic and organic substrates at temperatures as low as 100 degrees C.