Study on Compatible CMOS-MEMS Process with Surface Micromachining for the Application of Monolithic Integration

被引：0

作者：

Zhao, Danqi ^{[1
]}

Huang, Xian ^{[1
]}

He, Jun ^{[1
]}

Zhang, Li ^{[1
]}

Liu, Peng ^{[1
]}

Yang, Fang ^{[1
]}

Zhang, Dacheng ^{[1
]}

机构：

[1] Peking Univ, Inst Microelect, Natl Key Lab Sci & Technol Micro Nano Fabricat, Beijing, Peoples R China

来源：

2014 9TH IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS) | 2014年

关键词：

MEMS; post-CMOS; monolithic integration;

D O I：

暂无

中图分类号：

R318 [生物医学工程];

学科分类号：

0831 ;

摘要：

In this work, compatible CMOS-MEMS process with surface micromachining is investigated. Surface micromachining method for cantilever fabrication has been merged with conventional CMOS process, and release of MEMS structure is conducted after CMOS process. We designed polysilicon MEMS structures as well as CMOS devices and circuits on a monolithic sensor chip for the investigation of the influence of stress induced by non-adequate post-CMOS annealing. The impact of step coverage and the releasing process on both the MEMS and CMOS components are also discussed.

引用

页码：513 / 516

页数：4

共 5 条

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