Bromine fixation by metal oxide in pyrolysis of printed circuit board containing brominated flame retardant

被引：69

作者：

Terakado, O. ^{[1
]}

Ohhashi, R. ^{[1
]}

Hirasawa, M. ^{[1
]}

机构：

[1] Nagoya Univ, Grad Sch Engn, Dept Mat Sci & Engn, Chikusa Ku, Nagoya, Aichi 4648603, Japan

来源：

JOURNAL OF ANALYTICAL AND APPLIED PYROLYSIS | 2013年 / 103卷

关键词：

Brominated flame retardants; Metal oxide; Bromine fixation; Hydrogen bromide; Brominated organic compounds; THERMAL-DEGRADATION; TETRABROMOBISPHENOL-A; ABILITY;

D O I：

10.1016/j.jaap.2012.10.022

中图分类号：

O65 [分析化学];

学科分类号：

070302 ; 081704 ;

摘要：

Pyrolysis study of a printed circuit board (FR-4 type, epoxy resin reinforced by glass fibers) under the presence of metal oxide, such as ZnO, Fe2O3, La2O3, CaO and CuO, has been carried out in the view of the emission control of waste electrical and electronic equipment (WEEE) containing brominated flame retardants by metallurgical wastes like slags and dusts. The oxide content is of 2-10 mass% to the printed circuit board on the basis of the stoichiometric reaction of oxide and bromine to the corresponding metal bromide or oxybromide. It has been revealed that the formation of hydrogen bromide and brominated organic compounds is significantly suppressed by the addition of ZnO and La2O3. The bromine fixation ability of various oxides is compared and discussed. (c) 2012 Elsevier B.V. All rights reserved.

引用

页码：216 / 221

页数：6

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