Improved VLSI interconnect

被引:3
作者
Cumming, DRS [1 ]
机构
[1] Univ Glasgow, Dept Elect & Elect Engn, Glasgow G12 8QQ, Lanark, Scotland
[2] Univ Canterbury, Dept Elect & Elect Engn, Christchurch 1, New Zealand
关键词
D O I
10.1080/002072199132950
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Metal interconnect has become a major limiting factor in the growth of VLSI technology. A passive VLSI interconnect layout is proposed in which the current density is constant along its length. The result is a tapered track that has lower capacitance, hence lower power consumption, and improved high frequency performance. Simulations indicate that tapered tracks give delay reductions that permit operating frequencies up to 33% higher, and power savings of 42%, compared with equivalent rectangular tracks. Such interconnects will be of value in high speed clock nets where low skew and long paths are necessary.
引用
收藏
页码:957 / 965
页数:9
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